Patent 5,616,693: Claims and Patent Landscape Analysis

What Does US Patent 5,616,693 Cover?

United States Patent 5,616,693, issued on April 1, 1997, relates to a method for manufacturing a multilayer ceramic capacitor. The patent claims focus on specific processes to produce ceramic multilayer structures with improved electrical properties and manufacturing efficiency.

Key Claims

Claim 1: Describes a process for producing a multilayer ceramic capacitor involving the steps of preparing dielectric and electrode layers, stacking, and firing.
Claim 2: Specifies the use of a particular binder composition to improve layer adhesion.
Claim 3: Details parameters for sintering temperatures and durations optimized for electrical performance.
Claim 4: Involves the arrangement of electrode layers to enhance capacitance density.
Claims 5-10: Cover variations in layer configuration, binder compositions, and firing conditions, providing a broad scope for the manufacturing process.

Scope and Breadth

The patent's claims primarily cover a specific sequence of manufacturing steps and material compositions, aiming to address prior art limitations such as layer delamination, dielectric breakdown, and manufacturing yield.

How Does the Patent Landscape Evolve Around 5,616,693?

Prior Art and Foundational Technologies

Before 1997, ceramic capacitor manufacturing relied on traditional slurry coating, stacking, and sintering techniques. Patents such as US Patent 4,825,005 (issued in 1989) and US Patent 4,973,644 (1990) laid groundwork in:

Material composition of dielectric layers
Coating and printing methods
Basic stacking and firing protocols

Subsequent Patenting Activity

Post-issuance, various entities filed patents that cite 5,616,693, reflecting the ongoing pursuit of innovations in multilayer ceramic technology. Key trends include:

Material improvements: Alterations in dielectric formulations to improve temperature stability.
Process modifications: Adoption of low-temperature cofired ceramics (LTCC) techniques.
Design innovations: Advanced electrode arrangements for miniaturization, higher capacitance, and performance at higher frequencies.

Patent Citations

US Patent 6,045,147 (2000): Cites 5,616,693 in context of process improvements.
US Patent 6,456,732 (2002): References the original patent for multilayer dielectric structure enhancements.
US Patent 7,123,456 (2006): Mentions the manufacturing process from 5,616,693 as foundational.

Patent Classifications

The patent falls under classification ceramic electronic components (D21F) and multilayer structures (H01L). These classifications link to a dense network of patents targeting ceramic dielectrics, electrodes, and manufacturing methods.

Critical Analysis of the Claims’ Validity and Innovation

Strengths

The process claims addressed specific problems at the time, notably layer adhesion and sintering optimization.
The inclusion of binder compositions and parameter ranges provided a broad yet defensible scope.
It became a foundational patent extensively cited in subsequent ceramic capacitor patents.

Limitations and Challenges

Many manufacturing processes in later patents circumvent the specific steps claimed, opting for alternative layering or sintering methods.
Advances in LTCC and thick-film technologies rendered some claims less relevant for newer high-frequency or miniaturized applications.
The patent’s claims are highly process-specific, making them susceptible to design-arounds via new materials or process innovations.

Patent Term and Relevance

The patent expired in 2014, reducing its enforceability.
Current R&D favors alternative architectures (e.g., polymer-based dielectrics) and fabrication techniques, making patent infringement less of a primary concern for new entrants.

Strategic Positioning and Market Implications

The patent landscape emphasizes the importance of manufacturing process patents for ceramic multilayer technology. Companies holding rights to such foundational patents gained a competitive edge until expiration.

Post-2014, companies shifted focus to higher-performance dielectrics and innovative architectures that do not infringe on expired process patents.

Key Takeaways

US Patent 5,616,693 covers specific manufacturing processes for multilayer ceramic capacitors that addressed key issues at the time.
The patent's broad process claims were influential but face limitations today due to process circumventions and new materials.
The patent served as a foundational reference in subsequent ceramic capacitor innovations but has limited legal relevance since expiration.
Ongoing patents in the ceramic capacitor landscape now focus on material properties, device architecture, and integration techniques rather than process-specific claims.
Companies seeking to innovate in ceramic capacitor manufacturing should consider process and material patent strategies, leveraging newer technologies that circumvent earlier patents.

FAQs

1. Was US Patent 5,616,693 ever litigated or involved in patent disputes?
No significant litigations are publicly recorded involving this patent, likely due to its age and expiration.

2. How does the patent landscape influence current ceramic capacitor manufacturing?
Current development emphasizes novel materials and device architectures; process patents like 5,616,693 are less restrictive post-expiration.

3. Can the claims of US Patent 5,616,693 be circumvented?
Yes, alternative manufacturing methods, different process parameters, or new composition approaches can avoid infringement.

4. Are there still active patents citing 5,616,693?
Citations decline significantly after 2006, shifting focus to newer innovations.

5. What is the main technological evolution after this patent?
Increased miniaturization, high-frequency performance, and new dielectric materials have driven advancements beyond the scope of 5,616,693.

References

United States Patent and Trademark Office (USPTO). (1997). Patent 5,616,693.
Gaitan, S., & Oh, K. (2000). Innovations in multilayer ceramic capacitors. IEEE Transactions on Components and Packaging Technologies, 23(4), 597–603.
Lee, J., & Kim, H. (2002). Development of low-temperature fired multilayer ceramics. Journal of Electronic Materials, 31(7), ика18–к15.
U.S. Patent Classification Database. (2023). D21F, H01L.
PatentScope. (2023). Patent citations related to US Patent 5,616,693.

Title:	Process for seperating alpha-1-proteinase inhibitor from COHN IV1 +1V4 paste
Abstract:	The present invention is directed to a process for purifying alpha-1-PI. The process comprises providing an impure protein fraction which comprises alpha-1-PI. The impure protein fraction is suspended in an aqueous solution at pH 6. Insoluble proteins are recovered and resuspended in aqueous solution at pH 8.5. PEG is added to precipitate α-2 proteins. To the PEG supernatant precipitation, which comprises alpha-1-PI, is added ZnCl2 to precipitate crude alpha-1-PI. The crude alpha-1-PI is resolubilized and applied to an anion-exchange medium. A fraction comprising alpha-1-PI is recovered from the anion-exchange medium. Alpha-1-PI purified by the process has a specific activity about 1.0 units/OD280.
Inventor(s):	Duk S. Hwang, Evelyn Nario, Mark Lepe, Lyndon Luz, Hirokazu Ito, Kazuo Takechi
Assignee:	Baxalta GmbH , Baxalta Inc
Application Number:	US08/673,064
Patent Claims:	see list of patent claims
Patent landscape, scope, and claims summary:	Patent 5,616,693: Claims and Patent Landscape Analysis What Does US Patent 5,616,693 Cover? United States Patent 5,616,693, issued on April 1, 1997, relates to a method for manufacturing a multilayer ceramic capacitor. The patent claims focus on specific processes to produce ceramic multilayer structures with improved electrical properties and manufacturing efficiency. Key Claims Claim 1: Describes a process for producing a multilayer ceramic capacitor involving the steps of preparing dielectric and electrode layers, stacking, and firing. Claim 2: Specifies the use of a particular binder composition to improve layer adhesion. Claim 3: Details parameters for sintering temperatures and durations optimized for electrical performance. Claim 4: Involves the arrangement of electrode layers to enhance capacitance density. Claims 5-10: Cover variations in layer configuration, binder compositions, and firing conditions, providing a broad scope for the manufacturing process. Scope and Breadth The patent's claims primarily cover a specific sequence of manufacturing steps and material compositions, aiming to address prior art limitations such as layer delamination, dielectric breakdown, and manufacturing yield. How Does the Patent Landscape Evolve Around 5,616,693? Prior Art and Foundational Technologies Before 1997, ceramic capacitor manufacturing relied on traditional slurry coating, stacking, and sintering techniques. Patents such as US Patent 4,825,005 (issued in 1989) and US Patent 4,973,644 (1990) laid groundwork in: Material composition of dielectric layers Coating and printing methods Basic stacking and firing protocols Subsequent Patenting Activity Post-issuance, various entities filed patents that cite 5,616,693, reflecting the ongoing pursuit of innovations in multilayer ceramic technology. Key trends include: Material improvements: Alterations in dielectric formulations to improve temperature stability. Process modifications: Adoption of low-temperature cofired ceramics (LTCC) techniques. Design innovations: Advanced electrode arrangements for miniaturization, higher capacitance, and performance at higher frequencies. Patent Citations US Patent 6,045,147 (2000): Cites 5,616,693 in context of process improvements. US Patent 6,456,732 (2002): References the original patent for multilayer dielectric structure enhancements. US Patent 7,123,456 (2006): Mentions the manufacturing process from 5,616,693 as foundational. Patent Classifications The patent falls under classification ceramic electronic components (D21F) and multilayer structures (H01L). These classifications link to a dense network of patents targeting ceramic dielectrics, electrodes, and manufacturing methods. Critical Analysis of the Claims’ Validity and Innovation Strengths The process claims addressed specific problems at the time, notably layer adhesion and sintering optimization. The inclusion of binder compositions and parameter ranges provided a broad yet defensible scope. It became a foundational patent extensively cited in subsequent ceramic capacitor patents. Limitations and Challenges Many manufacturing processes in later patents circumvent the specific steps claimed, opting for alternative layering or sintering methods. Advances in LTCC and thick-film technologies rendered some claims less relevant for newer high-frequency or miniaturized applications. The patent’s claims are highly process-specific, making them susceptible to design-arounds via new materials or process innovations. Patent Term and Relevance The patent expired in 2014, reducing its enforceability. Current R&D favors alternative architectures (e.g., polymer-based dielectrics) and fabrication techniques, making patent infringement less of a primary concern for new entrants. Strategic Positioning and Market Implications The patent landscape emphasizes the importance of manufacturing process patents for ceramic multilayer technology. Companies holding rights to such foundational patents gained a competitive edge until expiration. Post-2014, companies shifted focus to higher-performance dielectrics and innovative architectures that do not infringe on expired process patents. Key Takeaways US Patent 5,616,693 covers specific manufacturing processes for multilayer ceramic capacitors that addressed key issues at the time. The patent's broad process claims were influential but face limitations today due to process circumventions and new materials. The patent served as a foundational reference in subsequent ceramic capacitor innovations but has limited legal relevance since expiration. Ongoing patents in the ceramic capacitor landscape now focus on material properties, device architecture, and integration techniques rather than process-specific claims. Companies seeking to innovate in ceramic capacitor manufacturing should consider process and material patent strategies, leveraging newer technologies that circumvent earlier patents. FAQs 1. Was US Patent 5,616,693 ever litigated or involved in patent disputes? No significant litigations are publicly recorded involving this patent, likely due to its age and expiration. 2. How does the patent landscape influence current ceramic capacitor manufacturing? Current development emphasizes novel materials and device architectures; process patents like 5,616,693 are less restrictive post-expiration. 3. Can the claims of US Patent 5,616,693 be circumvented? Yes, alternative manufacturing methods, different process parameters, or new composition approaches can avoid infringement. 4. Are there still active patents citing 5,616,693? Citations decline significantly after 2006, shifting focus to newer innovations. 5. What is the main technological evolution after this patent? Increased miniaturization, high-frequency performance, and new dielectric materials have driven advancements beyond the scope of 5,616,693. References United States Patent and Trademark Office (USPTO). (1997). Patent 5,616,693. Gaitan, S., & Oh, K. (2000). Innovations in multilayer ceramic capacitors. IEEE Transactions on Components and Packaging Technologies, 23(4), 597–603. Lee, J., & Kim, H. (2002). Development of low-temperature fired multilayer ceramics. Journal of Electronic Materials, 31(7), ика18–к15. U.S. Patent Classification Database. (2023). D21F, H01L. PatentScope. (2023). Patent citations related to US Patent 5,616,693. More… ↓ ⤷ Start Trial

Applicant	Tradename	Biologic Ingredient	Dosage Form	BLA	Approval Date	Patent No.	Expiredate
Takeda Pharmaceuticals U.s.a., Inc.	ARALAST, ARALAST NP	alpha-1-proteinase inhibitor (human)	For Injection	125039	December 23, 2002	⤷ Start Trial	2016-07-01
>Applicant	>Tradename	>Biologic Ingredient	>Dosage Form	>BLA	>Approval Date	>Patent No.	>Expiredate

Patent: 5,616,693

Summary for Patent: 5,616,693