Claims for Patent: 11,229,378

Summary for Patent: 11,229,378

Title:	Communication system with enhanced partial power source and method of manufacturing same
Abstract:	The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique current signature. The system can also measure the conditions of the environment surrounding the system.
Inventor(s):	Frank; Jeremy (San Francisco, CA), Bjeletich; Peter (Livermore, CA), Hafezi; Hooman (Redwood City, CA), Azevedo; Robert (Albany, CA), Duck; Robert (San Francisco, CA), Pesic; Iliya (Saratoga, CA), Costello; Benedict (Piedmont, CA), Snyder; Eric (South San Francisco, CA)
Assignee:	OTSUKA PHARMACEUTICAL CO., LTD. (Tokyo, JP)
Application Number:	16/689,578
Patent Claims:	1. A device comprising: a partial power source configured to provide energy for the device to conduct communication, when the partial power source is in contact with a conducting liquid; a support structure made from silicon material; a layer of adhesion material deposited directly onto the support structure at a first location; a first layer of CuCl material deposited directly on the layer of adhesion material using physical vapor deposition; a layer of transition metal deposited directly onto the support structure at a second location opposite the first location; and a second layer of material deposited directly onto the layer of transition metal, the second layer of material being dissimilar to the first layer of CuCl material. 2. The device of claim 1, wherein the physical vapor deposition is achieved through silicon sputter deposition. 3. The device of claim 1, wherein the physical vapor deposition is achieved through arc deposition. 4. The device of claim 1, wherein the second layer of material is Mg. 5. The device of claim 1, wherein the layer of adhesion material defines an uneven surface configured to improve adhesion. 6. The device of claim 5, wherein the uneven surface of the layer of adhesion material defines a plurality of holes. 7. The device of claim 6, wherein the plurality of holes are all spaced a predetermined distance away from all edges of the layer of adhesion, such that every hole of the plurality of holes is covered by at least some portion of the first layer of CuCl material. 8. A method of manufacturing a communication device comprising a non-conducting membrane and a partial power source device, said method comprising: generating the partial power source device, prepared according to a process that comprises: depositing a layer of transition metal on an opposite surface of a support structure from a surface having an adhesion material; depositing a layer of non-reactive material onto the support structure on a side opposite the transition metal, wherein the layer of non-reactive material defines a plurality of holes; depositing a first material onto the side with the adhesion material, wherein the first material adheres to the non-reactive material; and depositing a second material onto the layer of transition metal, wherein the first material and the second material are configured to produce a voltage potential difference when the first material and the second material come into contact with an electrically conductive fluid; cutting an opening into a sheet of non-conducting material to produce an assembly membrane sheet, wherein the shape of the opening corresponds to the shape of the partial power source device; inserting the partial power source device into the opening of the assembly membrane sheet to produce a loaded membrane sheet; and cutting out a perimeter of the load membrane sheet around the inserted partial power source device that includes a portion of the non-conducting material fitted around the partial power source. 9. The method of manufacturing a communication device of claim 8, wherein the process further comprises defining a boundary on the support structure, wherein each boundary corresponds to circuitry of the communication device. 10. The method of manufacturing a communication device of claim 9, wherein the process of depositing a layer of non-reactive material further comprises defining a group of holes, wherein each hole within the group of holes is contained within the boundary such that the position of each hole within the group of holes is within the boundary. 11. The method of manufacturing a communication device of claim 10, wherein the partial power source device is prepared according to the process further comprising depositing the first material over the adhesion material such that any edge of the first material is not positioned over any one of the group of holes. 12. The method of manufacturing a communication device of claim 10, wherein the partial power source device is prepared according to the process further comprising positioning the edge of the first material between any one edge of the adhesion material and the boundary.