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Serving leading biopharmaceutical companies globally:

US Army
Cipla
Julphar
Medtronic
Boehringer Ingelheim
Colorcon
Fuji
Cantor Fitzgerald
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Generated: January 19, 2018

DrugPatentWatch Database Preview

Details for Patent: 7,265,009

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Summary for Patent: 7,265,009
Title:HDP-CVD methodology for forming PMD layer
Abstract: A method of forming an HDP-CVD pre-metal dielectric (PMD) layer to reduce plasma damage and/or preferential sputtering at a reduced a thermal budget including providing a semiconductor substrate comprising at least two overlying semiconductor structures separated by a gap; forming a PMD layer according to an HDP-CVD process over the at least two overlying semiconductor structures without applying a chucking bias Voltage to hold the semiconductor substrate.
Inventor(s): Chen; Yao-Hsiang (Hsin-Chu, TW)
Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. (Hsin-Chu, TW)
Application Number:11/067,043
Patent Claim Types:
see list of patent claims
Use; Process;

Drugs Protected by US Patent 7,265,009

Applicant Tradename Generic Name Dosage NDA Approval Date TE Type RLD RS Patent No. Patent Expiration Product Substance Delist Req. Patented / Exclusive Use Patent Submitted
Applicant Tradename Generic Name Dosage NDA Approval Date TE Type RLD RS Patent No. Patent Expiration Product Substance Delist Req. Patented / Exclusive Use Patent Submitted

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Serving leading biopharmaceutical companies globally:

Julphar
Boehringer Ingelheim
Healthtrust
Colorcon
Baxter
Merck
Dow
Citi
Argus Health

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