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Serving hundreds of leading biopharmaceutical companies globally:

Farmers Insurance
US Department of Justice
Fuji
Cipla
Argus Health
Baxter
Citi
UBS
Federal Trade Commission

Generated: June 25, 2018

DrugPatentWatch Database Preview

Details for Patent: 7,049,230

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Summary for Patent: 7,049,230
Title:Method of forming a contact plug in a semiconductor device
Abstract: A contact plug is formed in a semiconductor device having a silicon substrate having a gate electrode, a junction area and an insulating interlayer. A contact hole is formed to expose the junction area. A plasma process is carried out with respect to a resultant substrate, thereby removing natural oxides created on an exposed surface of the junction area. A first silicon layer is deposited on the contact hole and on the insulating interlayer. A heat-treatment process is carried out with respect to the first silicon layer so as to grow the amorphous silicon into the epitaxial silicon. A second silicon layer is deposited on the first silicon layer.
Inventor(s): Park; Sung Eon (Seoul, KR)
Assignee: Hynix Semiconductor Inc. (Kyoungki-do, KR)
Application Number:10/984,494
Patent Claim Types:
see list of patent claims
Use; Process; Device;

Drugs Protected by US Patent 7,049,230

Applicant Tradename Generic Name Dosage NDA Approval Date TE Type RLD RS Patent No. Patent Expiration Product Substance Delist Req. Patented / Exclusive Use Patent Submitted
Applicant Tradename Generic Name Dosage NDA Approval Date TE Type RLD RS Patent No. Patent Expiration Product Substance Delist Req. Patented / Exclusive Use Patent Submitted

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Foreign Priority and PCT Information for Patent: 7,049,230

Foriegn Application Priority Data
Foreign Country Foreign Patent Number Foreign Patent Date
South Korea10-2003-0084311Nov 26, 2003
South Korea10-2003-0084313Nov 26, 2003

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Serving hundreds of leading biopharmaceutical companies globally:

Johnson and Johnson
Dow
Chubb
Boehringer Ingelheim
UBS
Harvard Business School
Queensland Health
Medtronic
QuintilesIMS

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