Details for Patent: 8,802,183

Title:	Communication system with enhanced partial power source and method of manufacturing same
Abstract:	The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique current signature. The system can also measure the conditions of the environment surrounding the system.
Inventor(s):	Frank; Jeremy (San Francisco, CA), Bjeletich; Peter (Livermore, CA), Hafezi; Hooman (Redwood City, CA), Azevedo; Robert (Albany, CA), Duck; Robert (San Francisco, CA), Pesic; Iliya (San Jose, CA), Costello; Benedict (Berkeley, CA), Snyder; Eric (South San Francisco, CA)
Assignee:	Proteus Digital Health, Inc. (Redwood City, CA)
Filing Date:	Jul 11, 2011
Application Number:	13/180,525
Claims:	1. A method of manufacturing a communication device including a partial power source, the method comprising: depositing a layer of adhesion material onto a first location of a support structure, wherein the layer of adhesion material defines a plurality of holes; depositing a first material onto the layer of adhesion material, wherein the first material adheres to the layer of adhesion material; depositing a layer of transition material onto a second location of the support structure; depositing a second material onto the layer of transition material, wherein the first material and the second material represent a voltage potential difference when the first material and the second material come into contact with a conducting fluid and spinning a polymer onto the device to provide a protective coating. 2. The method of claim 1, wherein the layer of adhesion material is gold. 3. The method of claim 1, further comprising the step of roughing the surface of the adhesion material to enhance adhesion property. 4. The method of claim 1, wherein the support structure is a silicon based material. 5. The method of claim 1, wherein depositing the first material comprises evaporating deposition using electron beams. 6. The method of claim 1, wherein the layer of adhesion material is less than 100 microns thick. 7. The method of claim 1, wherein depositing a layer of transition material comprises: depositing the layer of transition material onto the support structure; heating the support structure with the layer of transition material deposit; and cleaning an exposed surface of the layer of transition material such that the resulting structure is ready to receive the second material. 8. The method of claim 7, wherein cleaning the exposed surface further comprises cleaning with an ion gun. 9. The method of claim 7, further comprising spinning the device to evenly distribute a polymer on the surface of the device. 10. The method of claim 1, further comprising inserting the device into a non-conducting membrane. 11. The method of claim 1, wherein the transitional material is titanium.