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Details for Patent: 6,445,518

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Details for Patent: 6,445,518

Title: Three dimensional lead inspection system
Abstract:A semiconductor device lead inspection apparatus and method are provided for capturing images of the semiconductor edges and leads along two optical axes which have different directions in a plane perpendicular to the semiconductor device edge. A first image is reflected off an optical surface of a prism to a direction corresponding to the camera optical axis. A second image is reflected by two optical surfaces of the prism to a direction corresponding to the camera optical axis.
Inventor(s): Lee; Pao Meng (Melaka, MY)
Assignee: Semiconductor Technologies & Instruments, Inc. (Plano, TX)
Filing Date:Nov 28, 2000
Application Number:09/723,986
Claims:1. Apparatus for providing first and second backlit images of a semiconductor device edge and leads extending therefrom, said images representative of first and second viewing angles corresponding to first and second different optical axes as measured in a plane perpendicular to said device edge, comprising: at least one illuminator providing diffuse backlight illumination of said device edge and leads along said first and second optical axes; a triangular prism having a first optical surface facing said device edge and intersecting said first and second optical axes, a second optical surface forming an acute angle with said first optical axes, and a third optical surface, said first and second surfaces being at selected angles to said first and second optical axes to cause a first image of said device edge and leads along said first optical axis to be reflected by said second optical surface and emerge from said third optical surface in direction corresponding to a third optical axis and to cause a second image of said device edge and said leads along said second optical axis to be reflected by said second optical surface and said first optical surface and emerge from said third optical surface in a direction corresponding to said third optical axis; and a camera arranged to capture said first and second images along said third optical axis.

2. Apparatus as specified in claim 1 wherein said illuminator comprises an illuminated platform for holding said device.

3. Apparatus as specified in claim 2 wherein said camera is arranged on a side of said device opposite said illuminated platform when said device is received on said platform.

4. Apparatus as specified in claim 3 for providing backlit images of device edges and leads on two opposite sides of a semiconductor device and including two said triangular prisms on said opposite sides of said device and arranged on opposite sides of about said third optical axis.

5. Apparatus as specified in claim 1 wherein said first and second optical surfaces intersect at an angle of about 30 degrees.

6. Apparatus as specified in claim 1 wherein said prism is right angle prism.

7. Apparatus as specified in claim 1 wherein said first and second optical surfaces form equal angles with said third optical surface.

8. Apparatus as specified in claim 7 wherein said third optical surface is perpendicular to said third optical axis.

9. Apparatus as specified in claim 1 wherein said first and second optical paths intersect said second optical surface at an angle that is greater than the critical angle, measured from the normal direction of said second optical surface.

10. Apparatus as specified in claim 1 wherein said third optical axis intersects said first optical surface at an angle that is greater than the critical angle, measured from the normal direction of said first optical surface.

11. A method for providing first and second backlit images of a semiconductor device edge and leads extending therefrom, said images representing first and second viewing angles corresponding to first and second optical axes as measured in a plane perpendicular to said device edge, comprising: illuminating said device edge and leads with backlight diffuse illumination radiating in the directions of said first and second optical axes; providing a triangular prism having a first optical surface facing said device edge, a second optical surface forming an acute angle with said first optical surface and a third optical surface; a first image of said device edge and leads by said second optical surface in a direction emerging from said third optical surface corresponding to a third optical axis; reflecting a second image of said device edge and leads by said second and first optical surfaces in a direction emerging from said third optical surface corresponding to said third optical axes; and capturing said first and second images along said third optical axis.

12. A method as specified in claim 11 wherein said illuminating comprises illuminating from at least one illuminator arranged to radiate in the direction of said first and second optical axes toward said device edge and said leads.

13. A method as specified in claim 11 wherein said capturing said first and second backlit images comprises capturing said images on a single image plane of a camera on a side of said device opposite said at least one illuminator.

14. A method as specified in claim 11 for imaging device edges and leads on two opposite sides of a semiconductor, wherein there are provided two of said prisms on said opposite sides of said device; wherein said first and second images of each of said edges and leads are reflected in directions corresponding to said third optical axis; and wherein said first and second images of each of said device edges and leads are captured.
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