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Last Updated: April 19, 2024

Claims for Patent: 8,444,890


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Summary for Patent: 8,444,890
Title:Method of manufacturing a foam composition roller brush
Abstract: The invention is directed toward a chemical mechanical polishing/planarizing (CMP) brush with an embedded mandrel. PVA foam injected into the substantially hollow mandrel expands through apertures in the mandrel to fill a mold in the desired shape of the brush with the foam in the mandrel being integral with the outer foam covering the brush.
Inventor(s): Drury; Thomas J. (Willimantic, CT)
Assignee: Hydrofera, LLC (Libertyville, IL)
Application Number:13/064,973
Patent Claims:1. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush comprising the steps of: mounting a substantially cylindrical mandrel with an axial bore, said mandrel body defining a plurality of through going apertures therein providing access from said bore to the exterior of said mandrel, in a mold; heating foam generating material and solubilizing said material at about 190.degree. F.; injecting said mandrel bore with foam generating material and extruding said foam generating material through said apertures and into the mold; filling said mold with foam generating material; and, curing the foam within the mold thereby embedding said mandrel in the foam such that the foam inside and outside the mandrel are integrally connected.

2. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 1, further comprising the step of: removing said brush from said mold and trimming waste materials from said brush for a drop-in fit.

3. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 1 wherein said apertures are radially and longitudinally positioned on said mandrel.

4. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 1 wherein said mold is a substantially cylindrical mold.

5. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 1 wherein said axial bore is filled with said foam material prior to filling said mold.

6. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 1 including the step of removing the foam filled mandrel from the mold and washing the foam filled mandrel a plurality of times in a di-water carrier.

7. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 1 wherein said foam generating material is polyvinyl acetal with forming formaldehyde to provide cross linking and said plurality of washings removes forming formaldehyde from the polyvinyl acetal foam material.

8. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 7 wherein said formaldehyde present after said plurality of washings is less than 0.1 part per million.

9. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush comprising the steps of: mounting a substantially cylindrical mandrel with an axial bore, said mandrel body defining a plurality of through going apertures therein providing access from said bore to the exterior of said mandrel, in a mold; injecting said mandrel bore with foam generating material and extruding said foam generating material through said apertures and into the mold; filling said mold with foam generating material; curing the foam within the mold thereby embedding said mandrel in the foam such that the foam inside and outside the mandrel are integrally connected; and saturating the foam material in a range of about 1% to about 5% after curing in a solution to inhibit microbial formation.

10. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 9 wherein said solution is H.sub.2O.sub.2.

11. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 10 wherein said solution is sterile water and about 1.5% H.sub.2O.sub.2.

12. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush comprising the steps of: mounting a substantially cylindrical mandrel with an axial bore, said mandrel body defining a plurality of throughgoing apertures ranging from about 2% to about 80% of the surface area of the mandrel therein providing access from said bore to the exterior of said mandrel, in a substantially cylindrical mold; injecting said mandrel bore with foam generating polyvinyl acetal material and extruding said foam generating polyvinyl acetal material through said mandrel body apertures and into the substantially cylindrical mold; filling said substantially cylindrical mold and mandrel bore with foam generating polyvinyl acetal material to form a shaped foam brush; and, curing the foam within the mold thereby embedding said mandrel in the foam such that the foam inside and outside the mandrel are integrally connected; removing said shaped foam brush from said mold; and washing said foam filled mandrel to substantially remove a forming agent present in said cured form.

13. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 12 wherein said washing step is conducted a plurality of times in a di-water carrier.

14. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 12 wherein said forming agent is formaldehyde and said plurality of washings removes formaldehyde from the polyvinyl acetal foam material.

15. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 12 wherein said apertures in said mandrel range from about 10% to about 15% of the surface area of the mandrel.

16. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 12 including the step of saturating the foam material after curing in a solution to inhibit microbial formation.

17. A method of manufacturing a unitary chemical mechanical polishing (CMP) brush as claimed in claim 16 wherein said solution is H.sub.2O.sub.2.

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